Industry: LED technology saturation period needs more than 10 years


A lecture on LED technology sponsored by Jiangmen National Hi-tech Zone Optoelectronics Industry Association was officially held on May 15th. Ye Guoguang, Director of Marketing Center of Guangdong Deli Optoelectronics Co., Ltd., told the latest generation of LED technology FlipChip (Flip Chip) and No packaging process; other potential LED technology GaN homogeneous substrate, silicon substrate and other latest technical aspects.
The next five years will be the era of patching and arguing:
1. In 2015, everyone can achieve 180 lumens/watt. If they can't do it, the scale will be eliminated.
2. Before 2015, the upstream market was still oversupply, and only technology could drive the LED market forward. The high current density of the formal technology (SMD cost reduction) and flip chip technology (easy to package integration, reduce packaging costs) will be the mainstream.
3. Subversive technologies (silicon substrates or homogeneous substrates) will never affect the market.
4. After 2015, technology is no longer the dominant market force. Brands and special specifications products are market forces, and LEDs enter mature industries. The division of the world's pattern is clear: upstream in East Asia, lighting manufacturing in the Chinese mainland, access and design in Europe and the United States.
In addition, high current drive is the best way to reduce costs.
No package is only suitable for some applications. No package process is actually a package process. The LED chip coated with phosphor is directly soldered to the circuit substrate by SMT method. The companies currently developing this process include: Epistar LEDChip; Chip Optoelectronics and Chipscale Package CSP (Chip ScalePackage) wafer level package; Crystal and New Century FCOB (FlipChiponBoard) LEDiS, Match.
Comparison of no package process and traditional package:
1. The current no-package process technology route has been established, but it still takes time in the industrialization process, which is currently about 23 times the cost of the packaging process.
2. The optical problem has not been effectively solved. At present, the brightness has no obvious advantage compared with the traditional package.
3. If this process is to be adopted, most of the critical equipment needs to be updated, resulting in an increase in overall costs.
4. It is only suitable for some application products. For example, this process cannot be satisfied in large-volume applications such as lamps.
The impact of the substrate on the cost of the chip is getting smaller and smaller. The impact of the substrate on the cost of the chip is getting smaller and smaller: the increase in the cost of the substrate is the increase in the size of the sapphire wafer, not the cost of the substrate itself; there is currently no 6-inch silicon carbide. data.
From the development history of LED in the past ten years, Ye Guoguang found a little law:
1. Every time a revolutionary new technology (which can increase brightness by more than 30 at a time) matures, it will usher in a market and application explosion.
2. In the past few years, due to the excessive expansion of the Chinese mainland, new technologies can only slowly accumulate, oversupply (prices drop rapidly) and technology slowly improve and continue to grow after PSS technology. The ultimate challenge of technology seems to be coming soon.
In addition, Ye Guoguang also believes that: LED used to be, now, is still high technology in the future; technology saturation still needs more than 10 years of efforts; early important patents expired, more new patents increase coverage; efficiency improvement ( LM/W) depends on technological progress; cost reduction (LM/$) also depends on technological progress; technological strength determines product competitiveness; technology investment determines intellectual property capability; the future of China's LED industry depends on the speed and extent of technological progress; Talent training and R&D attitudes should be studied in Korea and Taiwan; peer cooperation and resource integration are essential to enhance the competitiveness of China's LED industry.

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