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Review the top ten technical hotspot keywords in the LED industry in 2013
After passing through 2013, I saw the ups and downs in the LED market and the hot spots in just one year. I also saw that the technology market is not far behind, and new technologies and new hot keywords are frequently used. First, COB, HV-LED, eutectic technology, COB sizzling technology market, and then the crystallization of flip-chip, flip-chip, package-free technology, the final LED industry needs mocvd equipment localization, intelligent lighting future, packaging mold Grouping is the future of the entire LED industry. There are indications that the entire LED lighting industry technology is undergoing an unpredictable market test and an unprecedented test. At the end of the year, let us review the top ten technical hotspots worthy of being remembered by history. Key words I. COB With the decline of LED market prices, the huge demand for general lighting applications and commercial lighting, special lighting, backlight and other fields, to promote the unit brightness of led light sources. The COB package has good performance in horizontal heat dissipation and vertical heat dissipation under a limited volume, and is suitable for achieving greater power in a small area. It has the following advantages: 1. Superior performance: Cob technology is used to directly bond the bare die of the chip to the PCB board, eliminating the requirement of wire bonding connection and making the product performance more reliable and stable. 2, higher integration: the use of cob technology, eliminating the link between the chip and the application board, improving the integration of the product. 3, the volume is smaller: the use of cob technology, because it can be bound on the pcb double-sided placement, correspondingly reduce the volume of the cob application module, expanding the application space of the cob module. 4, stronger ease of use, more streamlined product process: the original cluster bus technology is adopted, the use of pins between the cob board and the application board facilitates interconnection, eliminating the need for welding processes such as soldering. It reduces the difficulty of product use, simplifies product flow, and makes the product easier to replace, enhancing product usability. 5, lower cost: cob technology is directly bound on the pcb board, eliminating the need for the cost of the chip, welding and other processing processes, and the design of the user board is more simple, effectively reducing the cost of embedded products . Keyword 2: HV-LED HVLED is a high-voltage LED as its name suggests. Compared with traditional DCLED, it has the advantages of low packaging cost, high warm white light efficiency, high driving power efficiency and low line loss. Specifically: 1. HVLED realizes serial-parallel connection of micro-grains directly at the chip level, so that it works under low current and high voltage, which will simplify the die-bonding and bonding quantity of the chip and reduce the packaging cost. 2. The HV chip forms multiple micro-die integrations per unit area, avoiding the consistency problem caused by wavelength, voltage and brightness span in the BIN between chips; 3. The HVLED chip is a power chip driven at a small current. It can be integrated with red LED chip to form warm white light, which is more efficient than traditional DCLED red fluorescent powder yellow fluorescent powder, and shortens the gap between LED warm white and cool white packaging. And it is easier to realize the high index of the light source; 4. HVLED is easy to realize the working voltage of the packaged product is close to the mains due to its high working voltage, and the conversion efficiency of the driving power source is improved; due to the low working current, the line loss in the finished product application is also Will be significantly lower than the traditional DC power LED chip. Keyword 3: Eutectic technology Another hot packaging technology in 2013 was eutectic. Eutectic refers to the phenomenon of eutectic fusion of eutectic solder at relatively low temperatures. The eutectic alloy changes directly from solid to liquid without passing through the plastic stage. It is a liquid state that simultaneously produces two solid equilibrium reactions. Its melting temperature is called the eutectic temperature. The most critical of eutectic soldering technology is the choice of eutectic materials and the control of soldering temperature. For eutectic soldering, alloys such as pure tin (Sn) or gold-tin (Au-Sn) may be used as the contact surface coating on the bottom of the crystal grains, and the crystal grains may be soldered on the substrate coated with gold or silver. When the substrate is heated to a suitable eutectic temperature, gold or silver elements penetrate into the gold-tin alloy layer, the composition of the alloy layer changes to increase the melting point, the eutectic layer is cured and the LED is soldered to the heat sink or substrate. . The eutectic layer and the heat sink or the substrate are completely bonded together, breaking the thermal bottleneck in the heat dissipation system from the chip to the substrate, and improving the life of the LED. Although this technology was previously adopted by large manufacturers, the usual chip structure is not suitable for eutectic technology because it is a sapphire substrate. However, by 2013, the number of chip solutions accompanying non-sapphire substrates increased, and the high-power chip manufacturers using sapphire substrates introduced more flip-chip chips, making eutectic technology an option for Chinese packaging manufacturers to enhance their technological competitiveness. . Therefore, many manufacturers such as Ruifeng, Tiandian and so on spared no expense to purchase expensive eutectic solid crystal equipment. Key words four, flip chip technology Flip chip technology refers to the formation of a space from the wafer, substrate, bump, and the circuit structure is encapsulated in this space. The packaged chip has the advantages of small size, high performance, and short connection. Although flip chip technology has a compound annual growth rate of 19, it is not a new technology. It was first introduced to the market by IBM 30 years ago. Because of this, flip chip package is easy to be regarded as an old one. Unattractive mature technology. In fact, no matter which packaging technology is used, the process phase of bumping is still needed. In 2012, bump technology accounted for 81 installations in the middle-end process, with approximately 14 million wafers in 12-inch wafers; wafer fab loading rates were also high, especially for copper pillar platforms (Cupillarplatform, 88). . In terms of the size of the flip chip packaging market, it is estimated that its 2012 amount will reach US$20 billion (the largest market in the middle-end process). Yoledeveloppement expects the market to continue to grow at a rate of 9 per year, reaching US$35 billion in 2018. A new generation of flip chip ICs is expected to revolutionize the market and drive new demands for wafer bump technology; Lionel Cadix, senior packaging technology analyst at YoleDeveloppement, said: flip chip packaging in 3D integration and beyond Moore's Law It is one of the key technologies and will allow wafer integration to achieve sophisticated systems that have never been seen before. The flip chip package is being reshaped with the industry's demand for new copper bumps and microbump technology, and is gradually becoming the new mainstream bump metallurgy technology for wafer interconnects. Key words five, OLED OLED is called organic light-emitting diode, is a light-emitting diode based on organic semiconductor materials. OLED has many advantages such as all solid state, active illumination, high contrast, ultra-thin, low power consumption, no viewing angle limitation, fast response speed, wide operating temperature range, easy flexibility and large area, and low power consumption. At present, OLED has been applied in small-sized display fields such as mobile terminals, and the development potential in the field of large-size televisions and lighting has also been recognized by the industry. OLED has been recognized as one of the most promising display and lighting products of the 21st century. OLED, it is officially on the stage of lighting from 2012, although it is only a small role, but there is no small substitute for LED. At the Frankfurt show in April 2013, Philips first demonstrated the latest OLED technology Lumiblade OLEDGL350 panel, each GL350oled panel size of about 155 square centimeters, brightness up to 115LM. And in the United States on May 8-11, 2012 At the Vegas Lighting Fair, Philips once again exhibited an OLED mirror product that automatically senses the proximity of the human body, automatically adjusts the surrounding OLED light source module, and turns the middle into a mirror. Successfully integrated the concept of smart luminaires and OLEDs. As the leading brand in the global lighting market, Philips, the meaning of betting OLED is very obvious. Key words 6. Flip-chip technology The reason why flip-chips are called flip-chip is relative to the traditional wire bonding method (WireBonding) and the post-bulb process. Conventionally, the electronic surface of the wafer connected to the substrate by metal wire bonding is facing upward, and the electrical surface of the flip chip is facing downward, which is equivalent to turning the former over, so it is called a flip chip. The essence of flip chip is that on the basis of the traditional process, when the light-emitting area and the electrode area of ​​the chip are not designed in the same plane, the electrode area is mounted toward the bottom of the lamp cup, and the process of soldering the wire can be omitted. However, the precision of the process of solid crystal is high, and it is generally difficult to achieve a high yield. Advantages: A GaN-based LED structure layer is grown on a sapphire substrate by MOCVD technology, and light emitted from the P/N junction light-emitting region is emitted through the upper P-type region. Due to the poor conductivity of P-type GaN, in order to obtain good current expansion, a metal electrode layer composed of Ni-Au is formed on the surface of the P region by evaporation. The lead of the P region is taken up through the metal film of the layer. To achieve good current spreading, the Ni-Au metal electrode layer should not be too thin. For this reason, the luminous efficiency of the device is greatly affected, and it is usually necessary to take into account both the current expansion and the light extraction efficiency. However, in any case, the presence of the metal film always deteriorates the light transmission performance. In addition, the presence of wire bond pads also affects the light extraction efficiency of the device. The structure using GaN LED flip chip can fundamentally eliminate the above problem. Due to the need for high-power commercial lighting to develop in the direction of high current, high brightness and multi-integration, there are some inevitable disadvantages such as gold wire soldering chip and vertical chip packaging technology, such as gold wire soldering, surge impact, and resistance. The problem of insufficient flow capacity, thermal expansion and contraction of the encapsulated silica gel causes the gold wire to break, and the gold wire affects the yield in the process. Key words seven, package-free technology-free packaging technology is just the integration of technology, rather than let the package disappear, basically still packaging. As long as the blue phosphor achieves white light, it is a package. As for why the package-free technology in the market is sizzling, in the PFC package-free products, the flipchip-based chip design does not require wire bonding. The advantage of the PFC package-free wafer product is that the light efficiency is increased to 200 lm/W, and the illumination angle is greater than 300. The ultra-wide-angle full-period design of the degree, plus the need to use secondary optical lenses, will reduce the wear and cost of light efficiency. PFC new products will focus on the LED lighting market. Especially when applied to candle lamps, it can not only simulate the shape of tungsten lamps, but also break through the limitation of heat dissipation volume, and replace the traditional 40W tungsten candle lamp to achieve 3.5W with 350lm output. Key words 8. MOCVD localization In the last month of 2013, Zhonghao Semiconductor invested by Tianlong Optoelectronics Co., Ltd. and the ideal energy of Zhengtai Group have successively launched domestic MOCVD equipment. The domestic MOCVD, which had been hit by the low market environment, has once again set off a wave of enthusiasm. And the lack of confidence in the market, Zhonghao Optoelectronics has emphasized that more than 300 heats have been debugged before the release. Each furnace can carry 6080 pieces of 2-inch epitaxial wafers. For a time, the long-awaited domestic MOCVD once again ignited the enthusiasm of the market. According to incomplete statistics, China has developed and claimed more than 20 companies and research institutes in the development of MOCVD, and the level of excitement is not lower than that of epitaxial chip factories. For the long-term layout of China's development of the semiconductor lighting industry, it may be necessary to have a local MOCVD equipment manufacturer. If an industry develops rapidly and the upstream key equipment is completely dependent on overseas companies, it will inevitably fall into the majority of profits and be taken away. Disadvantages. In the "Twelfth Five-Year Development Plan for High-end Equipment Manufacturing Industry" issued by the Ministry of Industry and Information Technology, by 2015, the sales revenue of high-end equipment manufacturing industry will exceed RMB 6 trillion, and the proportion in the equipment manufacturing industry will increase to 15; by 2020, The sales revenue of high-end equipment manufacturing industry in the equipment manufacturing industry increased to 25. The Ministry of Science and Technology issued the "12th Five-Year Plan for Semiconductor Lighting Industry" also proposed that by 2015, large-scale MOCVD equipment and key raw materials will be localized. This means that now MOCVD may receive a large amount of subsidies from the government, so it is not difficult to understand that so many companies enter the industry with localization as their appeal. However, the crazy expansion of the extension manufacturers in the past two years has over-extended the market demand for MOCVD equipment. The prospects of domestic equipment are still in need of market testing. Keyword 9: Modular lighting is the basic needs of human beings, and lighting also represents the level of economic activity. And an LED lighting fixture, from design, material selection, testing, certification to the final market, is expensive and long. Often, there are already more competitive products in the process market after a project has been completed. Many costly new products and new designs have not yet had time to recover the cost and will be delisted. In the current situation of more intense competition and more difficult survival,